Home MYIR | System-On-Modules (SOMs) MYC-C335X-GW CPU Module
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MYIR | System-On-Modules (SOMs)

MYC-C335X-GW CPU Module

The MYC-C335X-GW is a compact, high-performance ARM-based System-on-Module (SoM) powered by the TI AM3354 ARM Cortex-A8 processor, ideal for gateway applications. It integrates 256MB/512MB DDR3L, 256MB NAND Flash or 4GB eMMC, and offers robust I/O connectivity through 146-pin expansion connectors. It is designed for industrial environments with extended temperature support from -40°C to +85°C, running Linux 4.14.67 OS..

  • Detail
  • Special Features
  • Specification

The MYC-C335X-GW integrates the TI AM3354 processor, which offers 1GHz performance with NEON™ SIMD coprocessor support and SGX530 graphics for 2D and 3D graphics acceleration. It also provides robust connectivity and peripheral options, including dual Gigabit Ethernet ports, multiple USB 2.0, UART, I2C, SPI, and CAN interfaces, making it perfect for embedded gateway systems. The module is designed for harsh environments, supporting extended temperature ranges of -40 to +85°C, and comes with a complete Linux 4.14.67 OS for rapid deployment. Its flexible 146-pin expansion interface supports a wide variety of I/O and expansion options, making it ideal for custom embedded system designs.

  • Processor: Up to 1GHz TI AM335x ARM Cortex-A8 processor (AM3352, AM3354, AM3356, AM3357, AM3358, AM3359).

  • Memory:

    • 256MB/512MB DDR3L (supports up to 1GB)

    • 256MB NAND Flash (supports optional 512MB/1GB)

    • 4GB eMMC Flash (alternative design with NAND Flash)

    • 256Kbit EEPROM

  • Graphics & Real-time Processing: SGX530 Graphics Engine and Programmable Real-Time Unit Subsystem.

  • Expansion Interface: Two 0.8mm pitch 80-pin board-to-board expansion connectors.

  • Connectivity: Dual Gigabit Ethernet, 2x USB 2.0, 6x UART, 2x CAN, 2x SPI.

  • Operating System: Ready-to-run Linux 4.14.67 OS.

  • Temperature Range: -40 to +85°C, suitable for industrial-grade applications.

  • Power Management: Includes TI’s TPS65217C Power Management IC for efficient energy handling.

  • Processor: TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (Up to 1GHz ARM Cortex-A8)

  • Graphics: SGX530 for 2D/3D acceleration

  • Memory:

    • 256MB/512MB DDR3L (supports up to 1GB)

    • 256MB NAND Flash (supports up to 512MB/1GB)

    • 4GB eMMC (supports up to 16GB/32GB)

    • 256Kbit EEPROM

  • Operating System: Linux 4.14.67

  • I/O Connectivity:

    • Dual Gigabit Ethernet Ports

    • 2x USB 2.0 (OTG)

    • 6x UART

    • 3x I2C

    • 2x SPI

    • 2x CAN

    • 8x ADC

    • 2x SDIO

    • 1x JTAG

    • 1x RGB Interface (supports RGB888 up to 2048x2048)

  • Power Management: TPS65217C Power Management IC

  • Temperature Range: -40 to +85°C (industrial grade)

  • Expansion Interface: 1.27mm pitch 146-pin Stamp Hole